The name of Xiaomi's custom SoC "Xring" was exposed a month ago, and the company quickly officially released this new chipset called XRING 01. Xiaomi CEO Lei Jun posted this news on Weibo social network, but as usual, he did not disclose important details such as specifications. Fortunately, we have already extensively reported on this information before, and now we will review it again so that you can understand what chips Xiaomi smartphones will use in the future.

Previously, there were reports that XRING 01 would adopt TSMC's 4nm technology, but there are rumors that Xiaomi will launch a 3nm version and may achieve mass production in the future.

Apart from mentioning that XRING 01 will be released later this month, the Weibo post did not share any other valuable information. It is currently unclear whether Xiaomi CEO wants to keep the audience in suspense or if there are other reasons. Previously, we reported that XRING 01 will be mass-produced using TSMC's older 4nm process. However, unlike Snapdragon 8 Elite, this independently developed solution will be based on ARM's current generation CPU design, with the fastest being Cortex-X925 with a clock speed of 3.20GHz.

Adopting the previous generation manufacturing process may mean that Xiaomi wants to avoid cost increases, but as we mentioned last year, this Chinese tech giant has successfully achieved the production of 3nm chipsets, implying that it may be launched at some point in 2025. In addition to increasing expenses, Xiaomi may also want to avoid unnecessary attention from the United States because it does not want to suffer the same fate as Huawei.

According to reports, Xiaomi has also hired 1000 employees to develop XRING 01, with the entire department led by a former senior director of Qualcomm who will report directly to Lei Jun. In short, saying that this joint venture has huge ambitions behind it is a huge understatement, and we look forward to its official release later this month.