| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
                 
                   
                
                 | 
				
                    AR 10-HZW/TNCONN IC DIP SOCKET 4POS TIN  |  
                3,310 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled | 
                 
                   
                
                 | 
				
                    AR 20-HZL/07-TTCONN IC DIP SOCKET 20POS GOLD  |  
                2,295 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR 40-HZL/01-TTCONN IC DIP SOCKET 40POS GOLD  |  
                3,778 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR 18-HZW/TNCONN IC DIP SOCKET 18POS GOLD  |  
                3,164 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR 24-HZL/07-TTCONN IC DIP SOCKET 24POS GOLD  |  
                3,339 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    A-CCS 052-Z-SMCONN SOCKET PLCC 52POS TIN  |  
                2,917 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled | 
                 
                   
                
                 | 
				
                    AR 48-HZL/01-TTCONN IC DIP SOCKET 48POS GOLD  |  
                2,416 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    A-CCS 068-Z-SMIC SOCKET PLCC 68POS TIN SMD  |  
                2,019 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled | 
                 
                   
                
                 | 
				
                    AR 32-HZL/07-TTCONN IC DIP SOCKET 32POS GOLD  |  
                2,793 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR 24-HZL/07/7-TTCONN IC DIP SOCKET 24POS GOLD  |  
                3,893 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AW 127-32/Z-TSOCKET 32 CONTACTS SINGLE ROW  |  
                3,160 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 
                 
                   
                
                 | 
				
                    AR 40-HZL/07-TTCONN IC DIP SOCKET 40POS GOLD  |  
                3,262 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR 48-HZL/07-TTCONN IC DIP SOCKET 48POS GOLD  |  
                2,064 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR 64-HZL-TTCONN IC DIP SOCKET 64POS TIN  |  
                3,297 | - | 
                
                     | 
                   
                
                  
                    
                 
                     Datasheet  | 
				 
                Tray | - | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR08-HZW/TCONN IC DIP SOCKET 8POS GOLD  |  
                2,044 | - | 
                
                     | 
                   
                
                  
                    
                
                     Datasheet  | 
				 
                Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR16-HZW/TCONN IC DIP SOCKET 16POS GOLD  |  
                3,633 | - | 
                
                     | 
                   
                
                  
                    
                
                     Datasheet  | 
				 
                Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR18-HZW/TCONN IC DIP SOCKET 18POS GOLD  |  
                2,034 | - | 
                
                     | 
                   
                
                  
                    
                
                     Datasheet  | 
				 
                Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR20-HZW/TCONN IC DIP SOCKET 20POS GOLD  |  
                3,272 | - | 
                
                     | 
                   
                   Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | |
                 
                   
                
                 | 
				
                    AR20-HZL-TTCONN IC DIP SOCKET 20POS TIN  |  
                2,257 | - | 
                
                     | 
                   
                
                  
                    
                
                     Datasheet  | 
				 
                Bag | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | 
                 
                   
                
                 | 
				
                    AR22-HZL-TTCONN IC DIP SOCKET 22POS TIN  |  
                3,467 | - | 
                
                     | 
                   
                
                  
                    
                
                     Datasheet  | 
				 
                Bag | - | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester |