Hello! Welcome to Honch E-technology Co.,Ltd ! Honch E-technology Co.,Ltdjessica@honch-etech.com

Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
299-87-622-10-002101

299-87-622-10-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

2,158 -
RFQ
299-87-622-10-002101

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICF-632-T-O

ICF-632-T-O

.100 SURFACE MOUNT SCREW MACHIN

Samtec Inc.

2,812 -
RFQ
Tube iCF Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
124-83-636-41-002101

124-83-636-41-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,590 -
RFQ
Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-642-41-009101

116-83-642-41-009101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

3,512 -
RFQ
116-83-642-41-009101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-012101

116-83-650-41-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,788 -
RFQ
116-83-650-41-012101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6513-10

32-6513-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,408 -
RFQ
32-6513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-648-41-009101

116-87-648-41-009101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

2,673 -
RFQ
116-87-648-41-009101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
04-0501-21

04-0501-21

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,142 -
RFQ
04-0501-21

Datasheet

Bulk 501 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-0501-31

04-0501-31

CONN SOCKET SIP 4POS GOLD

Aries Electronics

3,691 -
RFQ
04-0501-31

Datasheet

Bulk 501 Active SIP 4 (1 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-0503-20

09-0503-20

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3,029 -
RFQ
09-0503-20

Datasheet

Bulk 0503 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
09-0503-30

09-0503-30

CONN SOCKET SIP 9POS GOLD

Aries Electronics

2,070 -
RFQ
09-0503-30

Datasheet

Bulk 0503 Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
510-87-177-15-061101

510-87-177-15-061101

CONN SOCKET PGA 177POS GOLD

Preci-Dip

3,266 -
RFQ
510-87-177-15-061101

Datasheet

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-650-41-001101

122-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,121 -
RFQ
122-83-650-41-001101

Datasheet

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-650-41-001101

123-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,804 -
RFQ
123-83-650-41-001101

Datasheet

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-652-41-001101

122-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,659 -
RFQ
122-87-652-41-001101

Datasheet

Bulk 122 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-87-652-41-001101

123-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

3,883 -
RFQ
123-87-652-41-001101

Datasheet

Bulk 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3513-00

20-3513-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,437 -
RFQ
20-3513-00

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-4518-10M

20-4518-10M

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,538 -
RFQ
20-4518-10M

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-0518-11H

18-0518-11H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

3,377 -
RFQ
18-0518-11H

Datasheet

Bulk 518 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-1518-11H

18-1518-11H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,270 -
RFQ
18-1518-11H

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 200201202203204205206207...1100Next»
Honch E-technology Co.,Ltd

HOME

Honch E-technology Co.,Ltd

PRODUCT

Honch E-technology Co.,Ltd

PHONE

Honch E-technology Co.,Ltd

USER