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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-4822-90C

16-4822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,173 -
RFQ
16-4822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-4823-90C

16-4823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,686 -
RFQ
16-4823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6820-90C

16-6820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,907 -
RFQ
16-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6822-90C

16-6822-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,481 -
RFQ
16-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-6823-90C

16-6823-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,682 -
RFQ
16-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-0508-20

28-0508-20

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,141 -
RFQ
28-0508-20

Datasheet

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-0508-30

28-0508-30

CONN SOCKET SIP 28POS GOLD

Aries Electronics

2,225 -
RFQ
28-0508-30

Datasheet

Bulk 508 Active SIP 28 (1 x 28) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-20

28-1508-20

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,702 -
RFQ
28-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-1508-30

28-1508-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,836 -
RFQ
28-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-PGM06002-10

28-PGM06002-10

CONN SOCKET PGA GOLD

Aries Electronics

2,071 -
RFQ
28-PGM06002-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-11H

32-6518-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,670 -
RFQ
32-6518-11H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-6511-11

22-6511-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,182 -
RFQ
22-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
23-0503-20

23-0503-20

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,039 -
RFQ
23-0503-20

Datasheet

Bulk 0503 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
23-0503-30

23-0503-30

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,769 -
RFQ
23-0503-30

Datasheet

Bulk 0503 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
16-810-90

16-810-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,334 -
RFQ
16-810-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
13-7450-10

13-7450-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

3,737 -
RFQ
13-7450-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
13-7970-10

13-7970-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

2,684 -
RFQ
13-7970-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 13 (1 x 13) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-3513-11

38-3513-11

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,208 -
RFQ
38-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0503-21

15-0503-21

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2,989 -
RFQ
15-0503-21

Datasheet

Bulk 0503 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
15-0503-31

15-0503-31

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2,322 -
RFQ
15-0503-31

Datasheet

Bulk 0503 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
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