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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6572-10

28-6572-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2,779 -
RFQ
28-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6573-10

28-6573-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2,434 -
RFQ
28-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3570-10

28-3570-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,835 -
RFQ
28-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6570-10

28-6570-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,872 -
RFQ
28-6570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6556-20

24-6556-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,348 -
RFQ
24-6556-20

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
24-6556-30

24-6556-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,583 -
RFQ
24-6556-30

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
42-6556-10

42-6556-10

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

3,871 -
RFQ
42-6556-10

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
25-71000-10

25-71000-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,096 -
RFQ
25-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-71219-10

25-71219-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,840 -
RFQ
25-71219-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-71220-10

25-71220-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,915 -
RFQ
25-71220-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7350-10

25-7350-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,053 -
RFQ
25-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7390-10

25-7390-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,519 -
RFQ
25-7390-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7435-10

25-7435-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,438 -
RFQ
25-7435-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7450-10

25-7450-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,633 -
RFQ
25-7450-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7500-10

25-7500-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,850 -
RFQ
25-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7590-10

25-7590-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,352 -
RFQ
25-7590-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7625-10

25-7625-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,212 -
RFQ
25-7625-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7650-10

25-7650-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,000 -
RFQ
25-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7677-10

25-7677-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

2,367 -
RFQ
25-7677-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-7700-10

25-7700-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

3,834 -
RFQ
25-7700-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 25 (1 x 25) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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