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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
34-7650-10

34-7650-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

2,030 -
RFQ
34-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-7725-10

34-7725-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

2,118 -
RFQ
34-7725-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
34-7750-10

34-7750-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

2,502 -
RFQ
34-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 34 (1 x 34) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-7435-10

35-7435-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2,154 -
RFQ
35-7435-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-0508-20

40-0508-20

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2,782 -
RFQ
40-0508-20

Datasheet

Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-0508-30

40-0508-30

CONN SOCKET SIP 40POS GOLD

Aries Electronics

2,970 -
RFQ
40-0508-30

Datasheet

Bulk 508 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
52-9513-11H

52-9513-11H

CONN IC DIP SOCKET 52POS GOLD

Aries Electronics

2,683 -
RFQ
52-9513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6820-90C

32-6820-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,807 -
RFQ
32-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6822-90C

32-6822-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,508 -
RFQ
32-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6823-90C

32-6823-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,514 -
RFQ
32-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-20

30-9503-20

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,881 -
RFQ
30-9503-20

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-30

30-9503-30

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,411 -
RFQ
30-9503-30

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-822-90C

32-822-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,413 -
RFQ
32-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-823-90C

32-823-90C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,832 -
RFQ
32-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-822-90EWR

18-822-90EWR

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,606 -
RFQ
18-822-90EWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
28-6556-11

28-6556-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,605 -
RFQ
28-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
36-3503-20

36-3503-20

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,233 -
RFQ
36-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-3503-30

36-3503-30

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,348 -
RFQ
36-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
21-0503-21

21-0503-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,042 -
RFQ
21-0503-21

Datasheet

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
21-0503-31

21-0503-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

3,165 -
RFQ
21-0503-31

Datasheet

Bulk 0503 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
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