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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
12-0513-11

12-0513-11

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,002 -
RFQ
12-0513-11

Datasheet

Bulk 0513 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0518-10H

23-0518-10H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,526 -
RFQ
23-0518-10H

Datasheet

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0518-10T

25-0518-10T

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2,771 -
RFQ
25-0518-10T

Datasheet

Bulk 518 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-10T

40-6518-10T

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,751 -
RFQ
40-6518-10T

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3513-00

14-3513-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

3,442 -
RFQ
14-3513-00

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-0513-10H

14-0513-10H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

3,760 -
RFQ
14-0513-10H

Datasheet

Bulk 0513 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-0518-11H

11-0518-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,538 -
RFQ
11-0518-11H

Datasheet

Bulk 518 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-1518-10

28-1518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,410 -
RFQ
28-1518-10

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-2513-11H

06-2513-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,867 -
RFQ
06-2513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-4513-10T

22-4513-10T

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,062 -
RFQ
22-4513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0513-11

15-0513-11

CONN SOCKET SIP 15POS GOLD

Aries Electronics

2,708 -
RFQ
15-0513-11

Datasheet

Bulk 0513 Active SIP 15 (1 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6513-11

12-6513-11

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,222 -
RFQ
12-6513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-0513-10

20-0513-10

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,137 -
RFQ
20-0513-10

Datasheet

Bulk 0513 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0513-10T

22-0513-10T

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2,017 -
RFQ
22-0513-10T

Datasheet

Bulk 0513 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-0518-10T

26-0518-10T

CONN SOCKET SIP 26POS GOLD

Aries Electronics

2,673 -
RFQ
26-0518-10T

Datasheet

Bulk 518 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
26-1518-10T

26-1518-10T

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,314 -
RFQ
26-1518-10T

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
06-6513-11H

06-6513-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

2,810 -
RFQ
06-6513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-9513-10T

10-9513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,401 -
RFQ
10-9513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-00

20-3518-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,572 -
RFQ
20-3518-00

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-4518-00

20-4518-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,658 -
RFQ
20-4518-00

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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