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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-0518-10T

20-0518-10T

CONN SOCKET SIP 20POS GOLD

Aries Electronics

3,966 -
RFQ
20-0518-10T

Datasheet

Bulk 518 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-11

16-3518-11

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,884 -
RFQ
16-3518-11

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-C182-10

32-C182-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,774 -
RFQ
32-C182-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-2822-90

10-2822-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

3,868 -
RFQ
10-2822-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
40-C212-10

40-C212-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,426 -
RFQ
40-C212-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-516-11

28-516-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2,101 -
RFQ
28-516-11

Datasheet

Bulk 516 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
28-526-11

28-526-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2,587 -
RFQ
28-526-11

Datasheet

Bulk Lo-PRO®file, 526 Active DIP, ZIF (ZIP) 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
12-6810-90C

12-6810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,240 -
RFQ
12-6810-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-516-11

40-516-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,255 -
RFQ
40-516-11

Datasheet

Bulk 516 Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled
108-PRS12005-12

108-PRS12005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,971 -
RFQ
108-PRS12005-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
44-547-11E

44-547-11E

CONN SOCKET SOIC ZIF 44POS GOLD

Aries Electronics

2,015 -
RFQ
44-547-11E

Datasheet

Bulk 547 Active SOIC, ZIF (ZIP) 44 (2 x 22) - Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 20.0µin (0.51µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
14-6511-10

14-6511-10

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,801 -
RFQ
14-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4518-11

22-4518-11

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,676 -
RFQ
22-4518-11

Datasheet

Bulk 518 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
80-PGM15059-10

80-PGM15059-10

CONN SOCKET PGA GOLD

Aries Electronics

3,613 -
RFQ
80-PGM15059-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6574-10

28-6574-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,110 -
RFQ
28-6574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
01-0513-10

01-0513-10

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,106 -
RFQ
01-0513-10

Datasheet

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0513-10T

01-0513-10T

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,211 -
RFQ
01-0513-10T

Datasheet

Bulk 0513 Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-10

01-0518-10

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,739 -
RFQ
01-0518-10

Datasheet

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-10H

01-0518-10H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,059 -
RFQ
01-0518-10H

Datasheet

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
01-0518-10T

01-0518-10T

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,150 -
RFQ
01-0518-10T

Datasheet

Bulk 518 Active SIP 1 (1 x 1) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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