Hello! Welcome to Honch E-technology Co.,Ltd ! Honch E-technology Co.,Ltdjessica@honch-etech.com

Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-3570-16

28-3570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,745 -
RFQ
28-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6570-16

28-6570-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

3,494 -
RFQ
28-6570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6571-16

28-6571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

3,238 -
RFQ
28-6571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-6573-16

28-6573-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,707 -
RFQ
28-6573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3571-16

28-3571-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,819 -
RFQ
28-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3572-16

28-3572-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,974 -
RFQ
28-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3573-16

28-3573-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,415 -
RFQ
28-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
28-3574-16

28-3574-16

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

3,153 -
RFQ
28-3574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6572-16

28-6572-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2,518 -
RFQ
28-6572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6574-16

28-6574-16

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,134 -
RFQ
28-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-41-281-19-081002

510-41-281-19-081002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,115 -
RFQ
510-41-281-19-081002

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081002

510-91-281-19-081002

SOCKET SOLDERTAIL 281-PGA

Mill-Max Manufacturing Corp.

3,173 -
RFQ
Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081001

510-91-281-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,519 -
RFQ
510-91-281-19-081001

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-281-19-081003

510-91-281-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

2,077 -
RFQ
510-91-281-19-081003

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-480M29-001166

550-10-480M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3,829 -
RFQ
550-10-480M29-001166

Datasheet

Bulk 550 Active BGA 480 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
517-83-599-54-131111

517-83-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip

2,914 -
RFQ
517-83-599-54-131111

Datasheet

Bulk 517 Active PGA 599 (54 x 54) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
210-2599-50-0602

210-2599-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 210

3M

3,082 -
RFQ
Box - Active - - - - - - - - - - - - - -
48-6503-21

48-6503-21

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,669 -
RFQ
48-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6503-31

48-6503-31

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,100 -
RFQ
48-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
518-77-292M20-001106

518-77-292M20-001106

CONN SOCKET PGA 292POS GOLD

Preci-Dip

2,491 -
RFQ
518-77-292M20-001106

Datasheet

Bulk 518 Active PGA 292 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
Total 21991 Record«Prev1... 685686687688689690691692...1100Next»
Honch E-technology Co.,Ltd

HOME

Honch E-technology Co.,Ltd

PRODUCT

Honch E-technology Co.,Ltd

PHONE

Honch E-technology Co.,Ltd

USER