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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
17-0508-21

17-0508-21

CONN SOCKET SIP 17POS GOLD

Aries Electronics

3,303 -
RFQ
17-0508-21

Datasheet

Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
17-0508-31

17-0508-31

CONN SOCKET SIP 17POS GOLD

Aries Electronics

2,809 -
RFQ
17-0508-31

Datasheet

Bulk 508 Active SIP 17 (1 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
19-71080-10

19-71080-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2,358 -
RFQ
19-71080-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7375-10

19-7375-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

3,476 -
RFQ
19-7375-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7400-10

19-7400-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2,303 -
RFQ
19-7400-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7650-10

19-7650-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

3,090 -
RFQ
19-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7750-10

19-7750-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2,541 -
RFQ
19-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-81000-310C

20-81000-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,434 -
RFQ
20-81000-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81156-310C

20-81156-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,548 -
RFQ
20-81156-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81200-310C

20-81200-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,438 -
RFQ
20-81200-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81250-310C

20-81250-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,545 -
RFQ
20-81250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8190-310C

20-8190-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,410 -
RFQ
20-8190-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8240-310C

20-8240-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,414 -
RFQ
20-8240-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8260-310C

20-8260-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,843 -
RFQ
20-8260-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8280-310C

20-8280-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,970 -
RFQ
20-8280-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8300-310C

20-8300-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,323 -
RFQ
20-8300-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8310-310C

20-8310-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,705 -
RFQ
20-8310-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8312-310C

20-8312-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,556 -
RFQ
20-8312-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8323-310C

20-8323-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,663 -
RFQ
20-8323-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8325-310C

20-8325-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,647 -
RFQ
20-8325-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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