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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-8330-310C

20-8330-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,249 -
RFQ
20-8330-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8350-310C

20-8350-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,302 -
RFQ
20-8350-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8370-310C

20-8370-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,763 -
RFQ
20-8370-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8375-310C

20-8375-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,911 -
RFQ
20-8375-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8385-310C

20-8385-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,264 -
RFQ
20-8385-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8400-310C

20-8400-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,586 -
RFQ
20-8400-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8461-310C

20-8461-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,140 -
RFQ
20-8461-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8500-310C

20-8500-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,940 -
RFQ
20-8500-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8620-310C

20-8620-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,281 -
RFQ
20-8620-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8640-310C

20-8640-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,587 -
RFQ
20-8640-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8650-310C

20-8650-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,091 -
RFQ
20-8650-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8685-310C

20-8685-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,692 -
RFQ
20-8685-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8724-310C

20-8724-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,190 -
RFQ
20-8724-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8730-310C

20-8730-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,873 -
RFQ
20-8730-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8770-310C

20-8770-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,795 -
RFQ
20-8770-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8800-310C

20-8800-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,358 -
RFQ
20-8800-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8870-310C

20-8870-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,402 -
RFQ
20-8870-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8940-310C

20-8940-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,937 -
RFQ
20-8940-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8975-310C

20-8975-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,481 -
RFQ
20-8975-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
33-0508-20

33-0508-20

CONN SOCKET SIP 33POS GOLD

Aries Electronics

2,204 -
RFQ
33-0508-20

Datasheet

Bulk 508 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
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