Hello! Welcome to Honch E-technology Co.,Ltd ! Honch E-technology Co.,Ltdjessica@honch-etech.com

Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
146-83-310-41-035101

146-83-310-41-035101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,609 -
RFQ
146-83-310-41-035101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-310-41-036101

146-83-310-41-036101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,837 -
RFQ
146-83-310-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-105101

110-87-320-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,359 -
RFQ
110-87-320-41-105101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-420-41-001101

614-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,283 -
RFQ
614-87-420-41-001101

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-006101

116-83-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,340 -
RFQ
116-83-314-41-006101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-320-41-001101

614-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

2,849 -
RFQ
614-87-320-41-001101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-002101

116-83-210-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,225 -
RFQ
116-83-210-41-002101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-002101

116-83-310-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,579 -
RFQ
116-83-310-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-308-41-002101

124-83-308-41-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,220 -
RFQ
Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-0513-10

06-0513-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,361 -
RFQ
06-0513-10

Datasheet

Bulk 0513 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
02-0508-20

02-0508-20

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,147 -
RFQ
02-0508-20

Datasheet

Bulk 508 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
02-0508-30

02-0508-30

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,651 -
RFQ
02-0508-30

Datasheet

Bulk 508 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
02-1508-20

02-1508-20

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,814 -
RFQ
02-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
02-1508-30

02-1508-30

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

2,116 -
RFQ
02-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
14-3518-10T

14-3518-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,140 -
RFQ
14-3518-10T

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-210-41-018101

116-83-210-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,352 -
RFQ
116-83-210-41-018101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
AR 24-HZL/07-TT

AR 24-HZL/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

3,339 -
RFQ
AR 24-HZL/07-TT

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
110-83-306-41-105191

110-83-306-41-105191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

3,640 -
RFQ
Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-316-41-105101

117-87-316-41-105101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,184 -
RFQ
117-87-316-41-105101

Datasheet

Bulk 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-105191

110-87-316-41-105191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,999 -
RFQ
Tape & Reel (TR) 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 8687888990919293...1100Next»
Honch E-technology Co.,Ltd

HOME

Honch E-technology Co.,Ltd

PRODUCT

Honch E-technology Co.,Ltd

PHONE

Honch E-technology Co.,Ltd

USER