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Sockets for ICs, Transistors

制造商 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-87-624-41-003101

115-87-624-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

3,441 -
RFQ
115-87-624-41-003101

Datasheet

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-318-41-117101

114-83-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,211 -
RFQ
114-83-318-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-318-41-134161

114-83-318-41-134161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,730 -
RFQ
114-83-318-41-134161

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-009101

116-87-312-41-009101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

3,017 -
RFQ
116-87-312-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-105161

110-83-314-41-105161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,897 -
RFQ
110-83-314-41-105161

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-87-224-10-001101

410-87-224-10-001101

CONN ZIG-ZAG 24POS GOLD

Preci-Dip

2,433 -
RFQ
410-87-224-10-001101

Datasheet

Bulk 410 Active Zig-Zag, Left Stackable 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-87-224-10-002101

410-87-224-10-002101

CONN ZIG-ZAG 24POS GOLD

Preci-Dip

2,476 -
RFQ
410-87-224-10-002101

Datasheet

Bulk 410 Active Zig-Zag, Right Stackable 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-87-314-41-001101

122-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

3,077 -
RFQ
122-87-314-41-001101

Datasheet

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-318-41-018101

116-87-318-41-018101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

3,961 -
RFQ
116-87-318-41-018101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-011101

116-83-308-41-011101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,571 -
RFQ
116-83-308-41-011101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D2608-42

D2608-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

2,973 -
RFQ
D2608-42

Datasheet

Tube D26 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
116-83-210-41-008101

116-83-210-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

3,154 -
RFQ
116-83-210-41-008101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-008101

116-83-310-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,849 -
RFQ
116-83-310-41-008101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-318-31-012101

614-87-318-31-012101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

2,782 -
RFQ
614-87-318-31-012101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-87-320-41-001101

612-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

3,364 -
RFQ
612-87-320-41-001101

Datasheet

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-011101

116-87-310-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,474 -
RFQ
116-87-310-41-011101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
PX-20LCC

PX-20LCC

LEADLESS CHIP CARRIER 20P PBT RO

Kycon, Inc.

2,276 -
RFQ
Tube PX Active PLCC 20 (4 x 5) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
410-83-216-10-001101

410-83-216-10-001101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

3,960 -
RFQ
410-83-216-10-001101

Datasheet

Bulk 410 Active Zig-Zag, Left Stackable 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
410-83-216-10-002101

410-83-216-10-002101

CONN ZIG-ZAG 16POS GOLD

Preci-Dip

2,974 -
RFQ
410-83-216-10-002101

Datasheet

Bulk 410 Active Zig-Zag, Right Stackable 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
06-0518-11

06-0518-11

CONN SOCKET SIP 6POS GOLD

Aries Electronics

2,987 -
RFQ
06-0518-11

Datasheet

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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